ICTherm solves the physical equations that govern
the temperature in the circuit using the Finite Volume Method.
The circuit is discretized into small hexahedral cells that match
the distribution of the materials and the heat sources.
The heat transfers between the cells are approximated
using Taylor series expansions, leading to a matrix equation,
which is solved using efficient solvers.
Heat transfers supported:
ICTherm models conductive heat transfers inside the circuit
and convective heat transfers at the interface between the circuit
and the ambient air.
ICTherm supports all types of rectangular geometries.
Each component of the circuit is modeled as a rectangular block,
which allows to model complex 3D packages, TSV die stacking, etc.
Steady State Simulation:
ICTherm solves the matrix equation GT=P using a combination
of iterative/direct methods.
ICTherm solves the matrix equation CṪ+GT=P
using the Backward Euler method. The time step
of the transient simulation can be freely chosen,
as the Backward Euler method is unconditionnally stable.